JPS6039243U - 半導体素子の樹脂封入成形機 - Google Patents

半導体素子の樹脂封入成形機

Info

Publication number
JPS6039243U
JPS6039243U JP13168883U JP13168883U JPS6039243U JP S6039243 U JPS6039243 U JP S6039243U JP 13168883 U JP13168883 U JP 13168883U JP 13168883 U JP13168883 U JP 13168883U JP S6039243 U JPS6039243 U JP S6039243U
Authority
JP
Japan
Prior art keywords
molding machine
encapsulation molding
resin encapsulation
plungers
semiconductor elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13168883U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6334271Y2 (en]
Inventor
坂東　一雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP13168883U priority Critical patent/JPS6039243U/ja
Publication of JPS6039243U publication Critical patent/JPS6039243U/ja
Application granted granted Critical
Publication of JPS6334271Y2 publication Critical patent/JPS6334271Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP13168883U 1983-08-24 1983-08-24 半導体素子の樹脂封入成形機 Granted JPS6039243U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13168883U JPS6039243U (ja) 1983-08-24 1983-08-24 半導体素子の樹脂封入成形機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13168883U JPS6039243U (ja) 1983-08-24 1983-08-24 半導体素子の樹脂封入成形機

Publications (2)

Publication Number Publication Date
JPS6039243U true JPS6039243U (ja) 1985-03-19
JPS6334271Y2 JPS6334271Y2 (en]) 1988-09-12

Family

ID=30297636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13168883U Granted JPS6039243U (ja) 1983-08-24 1983-08-24 半導体素子の樹脂封入成形機

Country Status (1)

Country Link
JP (1) JPS6039243U (en])

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2883704A (en) * 1953-05-28 1959-04-28 Us Rubber Co Transfer molding apparatus
JPS5821343A (ja) * 1981-07-29 1983-02-08 Matsushita Electric Ind Co Ltd 樹脂封止装置
JPS5839889U (ja) * 1981-09-10 1983-03-16 株式会社パイロット 万年筆
JPS5897838A (ja) * 1981-12-08 1983-06-10 Toshiba Corp 半導体用樹脂封止装置
JPS5943525A (ja) * 1982-09-03 1984-03-10 Kyowa Denki Kagaku Kk 電子部品の絶縁包装部の形成方法および装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2883704A (en) * 1953-05-28 1959-04-28 Us Rubber Co Transfer molding apparatus
JPS5821343A (ja) * 1981-07-29 1983-02-08 Matsushita Electric Ind Co Ltd 樹脂封止装置
JPS5839889U (ja) * 1981-09-10 1983-03-16 株式会社パイロット 万年筆
JPS5897838A (ja) * 1981-12-08 1983-06-10 Toshiba Corp 半導体用樹脂封止装置
JPS5943525A (ja) * 1982-09-03 1984-03-10 Kyowa Denki Kagaku Kk 電子部品の絶縁包装部の形成方法および装置

Also Published As

Publication number Publication date
JPS6334271Y2 (en]) 1988-09-12

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